Method of wiring semiconductor device using energy beam
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorHiroaki Morimoto
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Abstract
A method of wiring a semiconductor device which allows a manufacturing step to be simplified without deteriorating an insulation characteristic of an aerial wiring. The semiconductor device wiring apparatus formed thereby includes a first beam column 1a disposed above a substrate 50 and a second beam column 1b disposed horizontally thereto. A wiring portion of the aerial wiring to be formed upwardly is formed by using the first beam column 1a and a wiring portion to be formed horizontally to wiring layer of the substrate 50 is formed by using the second beram column, which results in that no insulating film for the aerial wiring is required to simplify manufacturing steps.
Claims5
A method of wiring a semiconductor device by forming a connection wiring between a first wiring layer and a second wiring layer of said semiconductor device by supplying a reactive gas to the semiconductor device and irradiating the same with an energy beam, said method of wiring a semiconductor device comprising the steps of:
- supplying such a reactive gas as forms a conductive material constituting said connection wiring through the irradiation with said energy beam to a position where the connection wiring of said semiconductor device should be formed;
- forming a first connection portion on said first wiring layer by irradiating a surface of said first wiring layer of said semiconductor device with a first energy beam directed from above;
- forming a second connection portion spaced apart from a surface of said semiconductor device at a predetermined interval to extend from said first connection portion in a horizontal direction relative to the surface of said semiconductor device by irradiating a side surface portion of said first connection portion with a second energy beam provided along a direction crossing said first energy beam;
- and
- forming a third connection portion on said second wiring layer so as to connect with an end portion of said second connection portion by irradiating a surface of said wiring layer of the semiconductor device with the first energy beam from above.
The method of wiring a semiconductor device according to claim 11, wherein:
- said steps of forming said first, second and third connection portions include forming said first, second and third connection portions through respective irradiations with a focused ion beam.
Dependencies are inferred from the claim text.