Void filler

A collapsible and expandable void filler comprising a casing and a core mounted therein, said casing having opposed outer ends, a pair of side walls positioned in facing relation to each other and extending between said opposed outer ends of said casing, said core including multiple elongate strips, each of said strips having remote ends and being centrally folded to form adjacent panels joined at a vertex fold which defines hinge means between said panels of each strip, each strip extending between said side walls and having said remote ends thereof secured to said side walls, said side walls being selectively movable between an expanded position with said side walls remote from each other and with each of said strips having the adjacent panels thereof diverging at an angle relative to each other outward from the vertex fold therebetween, and a collapsed position with said side walls adjacent each other and with each of said strips having the adjacent panels thereof folded in substantially parallel overlying orientation to each other wherein said elongate strips comprise first and second inner strips positioned inward of said opposed outer ends of said casing with said vertex folds thereof oppositely directed and in facing relation to each other, said vertex folds of said first and second strips, in said expanded position being parallel and proximate, and in said collapsed position being parallel and laterally offset, with the panels of said first strip overlapping and substantially paralleling the panels of said second inner strip to form overlapping portions.