Method for manufacturing semiconductor-mounting heat-radiative substrates and semiconductor package using the same
AssigneeSumitomo Electric Industries, Ltd.
InventorsMitsuo Osada, Kenichiro Kohmoto
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Abstract
A method for manufacturing heat-radiative substrates on which semiconductor devices such as ICs and transistors are mounted and packages using the substrates, wherein a plurality of CuW or CuMo composite materials obtained by the infiltration method or the mixed powder sintering method are joined together with Cu interposed therebetween. Accordingly, the remaining empty holes within the CuW or CuMo materials are filled sufficiently with Cu, allowing high-quality packages having a successful thermal characteristic to be obtained.
Claims3
A method for manufacturing a semiconductor-mounting heat-radiative substrate, which is a joined body of a CuW or a CuMo composite metal alloy with a pore-free Cu-layer interposed therebetween, comprising the step of joining together a plurality of CuW or CuMo composite metal alloys obtained by an infiltration method or a mixed powder sintering method, wherein Cu is disposed on an interface between said CuW or CuMo composite metal alloys and said plurality of CuW or CuMo composite metal alloys are joined together through Cu by heating them to the melting point of Cu or higher in a reducing atmosphere.
Dependencies are inferred from the claim text.