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US 5,305,944 AGranted
Bonding method and bonding apparatus
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsMasaharu Yoshida, Yasufumi Nakasu, Masataka Takehara
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AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsMasaharu Yoshida, Yasufumi Nakasu, Masataka Takehara
Estimating the term…
A bonding apparatus according to the present invention bonds a semiconductor chip to a conductive member in the face-down style without heating the semiconductor chip. The semiconductor chip which consists essentially of silicon is placed on leads which are put on a TAB tape. A glass plate member is mounted on the semiconductor chip. An infrared light beam is irradiated onto the semiconductor chip from above the semiconductor chip. Transmitted by the semiconductor chip, the infrared light beam illuminates bumps. As a result, the bumps heat up and melt. Since the semiconductor chip does not absorb the infrared light beam, bonding of the semiconductor chip to the leads does not cause a rise in temperature of the semiconductor chip. The bonding apparatus according to the present invention makes the face-down style bonding possible.
A method of bonding a semiconductor chip to an object to be bonded, said semiconductor chip having first and second major surfaces, said object to be bonded including a conductive member, said method comprising the steps of:
A bonding apparatus for bonding a semiconductor chip which consists essentially of silicon to an object to be bonded which includes a conductive member, said semiconductor chip having first and second major surfaces, comprising:
Dependencies are inferred from the claim text.