Method of direct transferring of electrically conductive elements into a substrate

A method of forming and transferring electrically conductive, semiconductive, resistive, or capacitive elements into a deformable dielectric material, comprising the steps of:

• providing a multilayer structure comprising a sheet, molding, casting, or composite structure of a deformable dielectric material and a sheet of a conducting, semiconducting, or resistive material, said conducting, semiconducting, or resistive material being in direct contact with said dielectric material;
• and
• punching or stamping said multilayer structure so as to form and transfer a slug of material from the sheet of conducting material into the dielectric material, wherein the transferred slug is selected from the group consisting of capacitors, resistors, inductors, and semiconductor devices.

A method of forming and transferring electrically conductive, semiconductive, resistive, or capacitive elements into a deformable dielectric material, comprising the steps of:

• providing a multilayer structure comprising a sheet, molding, casting, or composite structure of a deformable dielectric material and a sheet comprising circuit elements selected from the group consisting of capacitors, resistors, inductors, and semiconductor devices, said sheet comprising circuit elements being in direct contact with said dielectric material;
• and
• punching or stamping said multilayer structure so as to form and transfer a slug of material from the sheet comprising circuit elements into the dielectric material.

A method of forming and transferring electrically conductive, semiconductive, resistive, or capacitive elements into a deformable dielectric material, comprising the steps of:

• providing a multilayer structure comprising a sheet, molding, casting, or composite structure of a deformable dielectric material and a clad sheet comprising a conducting material first layer and a second layer selected from the group consisting of semiconducting materials, resistive materials, and dielectric materials, said clad sheet being in direct contact with said dielectric material;
• and
• punching or stamping said multilayer structure so as to form and transfer a slug of material from the clad sheet into the dielectric material so as to cause a clad slug to be transferred.