A planar microwave integrated circuit device comprising a microwave Magic-Tee circuit arrangement comprising a sandwich arrangement of a conductive ground plane layer and two dielectric layers, each dielectric layer having an innermost surface and an outermost surface, the ground plane layer being sandwiched between respective innermost surface, a microstrip Tee circuit element disposed on the outermost surface of one of the two dielectric layers and a microstrip line conductor disposed on the outermost surface of the other of the two dielectric layers, the microstrip Tee circuit element comprising first, second and third conductors, respectively, joined together to define a junction of the Tee, the first and second conductors comprising respective branch arms of the Tee and the third conductor comprising a leg of the Tee, the Tee leg being symmetrical about a longitudinal axis thereof and having a width oriented transversely to said longitudinal axis, the circuit arrangement further comprising an aperture disposed within said ground plane layer at a position between said Tee junction and a part of said line conductor, said Tee junction, aperture and part of said line conductor being substantially in register in a direction perpendicular to said layers, said aperture having an axis of symmetry aligned with said longitudinal axis of said Tee leg, said Tee junction being aperture coupled with said part of the line conductor through said aperture, said microstrip Tee circuit element and said microstrip line conductor being connected to respective microstrip conductors at other parts of said microwave integrated circuit device.