Interconnect arrangement for electronic components disposed on a circuit board

A substrate with improved electrical performance, comprising:

• a plurality of separate signal lines that extend respective predetermined distances within the substrate, with each signal line having at least one common connection node disposed along its length;
• a separate via means that connects to each of the common connection nodes of the separate signal lines;
• and
• a plurality of electrical component connection means that connect a plurality of electrical components disposed at first and second opposing surfaces of the substrate to each of the via means, with each of the electrical component connection means associated with a particular via means for connecting a predetermined connection point of an electrical component disposed at first or second opposing surface of the substrate to that particular via means, the electrical components being arranged at the first and second opposing surfaces of the substrate such that predetermined connection points of a plurality of electrical components at each surface, and associated with a particular via means, are an optimal minimum distance from the common connection node to which it connects through that particular via means.