Polymeric composite lead wire and method for making same

An electrical lead suitable for providing circuit continuity between an electronic device and a printed circuit board, said lead comprising an elongated polymeric dielectric core having disposed thereon a metallic conductor layer comprising at least two separate conductive paths including a first conductive path disposed along a first peripheral edge region of said polymeric dielectric core, and a second conductive path disposed along a second peripheral edge region of said polymeric dielectric core and electrically insulated from said first conductive path.

A semiconductor device comprising a molded main body containing an electronic circuit element and a plurality of electrical leads extending therefrom and existing said main body, each of said leads comprising a polymeric dielectric core having disposed thereon a metallic conductor layer comprising at least two separate conductor paths for connecting a pair of terminals disposed on said circuit element to a pair of conductive surfaces on a printed circuit board, a first conductor paths being disposed along peripheral edge regions of said dielectric core, and a second conductive path disposed along a second peripheral edge region of said polymeric dielectric core and electrically insulated from said first conductive path by an exposed portion of said polymeric dielectric core.

An electrical lead assembly having at least four conductive paths, and comprising a pair of leads, each of said leads having a polymeric dielectric core comprising a metallic conductive layer having at least two separate conductive paths thereon, a first of said leads comprising a dielectric, laterally extending male portion, and a second of said leads comprising a dielectric laterally extending female portion, said male and female portions being adhered together to form said lead assembly.