Three-dimensional multi-chip module

A multi-chip module having a plurality of semiconductor elements arranged three-dimensionally, said module comprising:

• a substrate having first and second surfaces and including wiring patterns providing a respective plurality of electrode terminals on each of said surfaces;
• a first semiconductor element having a front face and a back surface, said first element being mounted on the substrate with its front face on said first surface of the substrate and being operatively connected to electrode terminals on said first surface;
• a second semiconductor element mounted on the second surface of the substrate, said second element being operatively connected to electrode terminals on said second surface;
• a heat conductive base having a contact surface which faces the first surface of the substrate, said contact surface being in thermal contact with the back surface of said first element;
• a support base having a plurality of outer leads and a plurality of electrode terminals operatively connected to the outer leads, said base having an opening therein, said substrate with the semiconductor elements thereon being disposed in said opening, said electrode terminals on the support base being operatively connected to said electrode terminals on the substrate, said support base being affixed to said heat conductive base, and said support base being in thermal contact with said substrate and said heat conductive base.

A multi-chip module having a plurality of semiconductor elements arranged three-dimensionally, said module comprising:

• a substrate having first and second surfaces and including wiring patterns providing a respective plurality of electrode terminals on each of said surfaces;
• a first semiconductor element having a front face and a back surface, said first element being mounted on the substrate with its front face on said first surface of the substrate and being operatively connected to electrode terminals on said first surface;
• a second semiconductor element mounted on the second surface of the substrate, said second element being operatively connected to electrode terminals on said second surface;
• a heat conductive base having a contact surface which faces the first surface of the substrate, said contact surface being in thermal contact with the back surface of said first element,
• said second element being in thermal contact with only said substrate.