Packaged circuit-boards
AssigneeUnisys Corporation
InventorsD. Edmond Freige, Richard N. Hibbs
Life of this patent
Estimating the term…
Abstract
Embodiments disclose modular packaged circuit-boards (plug-in "cards") packaged in like modules, and cooled along with a motherboard in an integrated design.
Claims28
Circuit package means for use with prescribed base means that includes receiving-board means and superposed deck means including slot means and deck-vent holes, this package means comprising:
- circuit board means including connector means arranged to be removably connected into the receiving-board means;
- and nonconductive envelope means constructed to house and and closely surround said circuit board means, said envelope means being relatively square and including tang means, projected centrally from a bottom-edge portion thereof surrounding said connector means, and being arranged and adapted to interfit with a receiving one of said slot means in said deck means, said bottom-edge portion also including vent aperture means adapted for registry with respective ones of said deck vent holes;
- said envelope means also including upper vent means along an upper-edge portion, opposite said bottom-edge portion, and also including cooling-vent slit means in other portions of said envelope means whereby to conduct coolant-air from upper portions thereof, down across the circuit-board means, to exit through said vent aperture means in said bottom-edge portion and onto said receiving board means for cooling thereof.
Data handling apparatus including N circuit-package means, cover means disposed about said circuit-package means, and base means including slotted deck means and motherboard means mounted thereunder;
- this deck means including N sets of apertures therein, each set being identical, placed side-by-side in parallel, and comprising a connector-slot flanked by one or more vent-slots;
- each said circuit-package means comprising circuit means including connector means, packaged in essentially-identical, nonconductive envelope means,
- each connector means arranged to be connected-into said motherboard means;
- each envelope means being constructed to house and closely-surround its respective circuit means, each said envelope means including a bottom-edge portion with vent means and including tang means surrounding said connector means projected centrally from a bottom-edge segment thereof, this segment being different from said bottom-edge portion and being arranged and adapted to interfit with a receiving one of said connector slots in said deck means;
- each said envelope means also including vent means whereby to conduct coolant-air from upper portions thereof, down across its circuit means, to exit through said vent-means in said bottom edge portion, then onto said motherboard means for cooling thereof.
A control circuit array comprising:
- one or more circuit-package means and associated receiving base means,
- said base means including receiving-circuit-board means having an array of N connector-receptacle means, plus deck means superposed over said board means and including vent holes and N sets of apertures, each set comprising a slot superposed above a respective one of said receptable means plus one or more flanking vents;
- each said circuit-package means comprising;
- circuit board means including connector means arranged to be removably connected-into said receiving-board means;
- and nonconductive envelope means constructed and adapted to house and closely-surround said circuit board means, said envelope means being relatively square and including tang means projected centrally from a bottom-edge portion thereof surrounding said connector means, and being arranged and adapted to interfit with a receiving one of said slot means in said deck means, said bottom-edge portion also including vent aperture means adapted for registry with respective ones of said deck vent holes;
- said envelope means also including upper vent means along an upper-edge portion, opposite said bottom-edge portion, and also including cooling-vent slit means in other portions of said envelope means whereby to conduct coolant-air from upper portions thereof, down across the circuit-board means, to exit through said vent aperture means in said bottom edge portion and onto said receiving-board means for cooling thereof.
An array of essentially-identical circuit package means for use with prescribed base means, said base means including receiving-circuit-board means having an array of N connector-receptacle means plus deck means superposed over said board means and including N sets of apertures, each set comprising a slot superposed above a respective one of said receptacle means plus one or more flanking vents;
- each said package means comprising:
- circuit board means including connector means arranged to be removably connected-into said receiving-board means;
- and nonconductive envelope means constructed and adapted to house and closely-surround said circuit board means, said envelope means being relatively square and including tang means projected centrally from a bottom-edge portion thereof surrounding said connector means, and being arranged and adapted to interfit with a receiving one of said slots in said deck means, said bottom-edge portion also including vent aperture means adapted for registry with respective ones of said deck vents;
- said envelope means also including upper vent means along an upper-edge portion, opposite said bottom-edge portion, and also including cooling-vent slit means in other portions of said envelope means whereby to conduct coolant-air from upper portions thereof, down across the circuit board means, to exit through said vent aperture means in said bottom edge portion and onto said receiving-board means for cooling thereof.
Dependencies are inferred from the claim text.