High voltage, laminated thin film surface mount fuse and manufacturing method therefor

A thin film surface mount fuse comprising:

• a generally rectangular, insulating substrate having an upper planar surface, opposite end surfaces perpendicular to the top surface and a lower planar surface;
• a deposited, electrically conductive thin film on the upper surface of the substrate, the thin film defining a fuse element comprising a pair of contact portions interconnected by at least one link having a width smaller than that of the contact portions, the link being fusible in response to a predetermined current therethrough, each of the contact portions having an exposed outer edge flush with an end surface of the substrate;
• an insulating cover coextensive with the substrate and having end surfaces, the insulating cover being bonded to the upper surface of the insulating substrate, the end surfaces of the substrate and cover and the outer edges of the thin film element defining opposed end faces of the surface mount fuse, the insulating cover having an upper planer surface;
• a first cover layer coextensive with the insulating cover and bonded to upper surface thereof, the first cover layer having an upper surface;
• a second cover layer coextensive with the insulating substrate and bonded to the lower surface thereof, the second cover layer having a lower surface, the first and second cover layers having a mechanical strength greater than that of the substrate and insulating cover;
• and
• an electrically conductive termination covering each of the end faces of the fuse and being in electrical contact with the outer edge of one of the contact portions of the fuse element, each termination having a leg extending along a portion of the upper surface of the first cover layer and a leg extending along a portion of the lower surface of the second cover layer.