Loading patent…
AssigneeNational Semiconductor Corporation
InventorsLuu T. Nguyen, Hem P. Takiar
Estimating the term…
A method of making an integrated circuit package is disclosed herein along with the package itself, which package is encapsulated by plastic that is caused to flow in a given direction during the package's formation. The package itself includes an IC chip having an array of chip output/input terminals, and means for supporting the chip including an array of electrically conductive leads, all of which are provided for connection with the output/input terminals of the IC chip. In addition, the overall package includes bonding wires connecting the chip output/input terminals with respective ones of the leads such that each bonding wire extends in a direction that defines an acute angle of less than 45 degrees with the given flow direction of the plastic material used to encapsulate the IC chip, support means and bonding wires. In a preferred embodiment, at least a portion and most preferably substantially all of the bonding wires are substantially parallel with the given flow direction of the plastic material.
An integrated circuit package encapsulated by plastic which during formation of the package was caused to flow over the latter in a given flow direction, said package comprising:
An integrated circuit package encapsulated by plastic which during formation of the package was caused to flow over the latter in a given flow direction, said package comprising:
A dielectric substrate for supporting an IC chip having an array of output/input terminals within and forming part of an integrated circuit package encapsulated by plastic which, during formation of the package, was caused to flow over the latter in a given flow direction, said substrate comprising:
A lead frame for supporting an IC chip having an array of output/input terminals within and forming part of an integrated circuit package encapsulated by plastic which, during formation of the package, was caused to flow over the latter in a given flow direction, said lead frame comprising:
Dependencies are inferred from the claim text.