Method and apparatus for a semiconductor device having a radiation part
AssigneeFujitsu Limited
InventorsMichio Sono, Junichi Kasai
Life of this patent
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Abstract
A semiconductor device includes a stage having top and bottom surfaces, a semiconductor element which is mounted on the top surface of the stage, a package part which is made of a first resin and encapsulates the semiconductor element so that a surface of the package part and the bottom surface of the stage lie on substantially the same plane, and a radiation part which is made of a second resin and is provided directly on the bottom surface of the stage and the surface of the package part. The second resin includes a filler material selected from a group consisting of metal powders and insulator powders so that a thermal conduction of the second resin is greater than that of the first resin.
Claims6
A semiconductor device comprising:
- a stage having top and bottom surfaces;
- a semiconductor element mounted on the top surface of the stage;
- a package part made of a first resin which encapsulates the semiconductor element and the stage therewithin and such that a surface of the package part and the bottom surface of the stage lie in substantially a common plane;
- and
- a radiation part made of a second resin and molded directly on the bottom surface of the stage and the surface of the package part and thereby having a surface lying in the common plane and in integral and thermally conductive relationship with the bottom surface of the stage, said second resin including a filler material comprising metal powder and insulator powder materials selected to provide a value of thermal conduction of the second resin which is greater than that of the first resin, said radiation part having a fin structure extending outwardly from the surface thereof lying in the common plane.
Dependencies are inferred from the claim text.