Circuit arrangement with a cooling member
AssigneeExport-Contor Aussenhandelsgesellschaft mbH
InventorsHeinrich Heilbronner, Werner Tursky, Christian Goebl, Thomas Frank
Life of this patent
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Abstract
The circuit arrangement comprises a mounting plate carrying at least one preferably chip-form component and contact surfaces electrically conductively connected to the component by connecting elements. The mounting plate is carried on a cooling member and is pressed thereagainst by a pressing arrangement. The pressing arrangement has a mounting element, with an elastically yielding cushion element on the side which is towards the cooling member, to press against the electrical component and/or in the vicinity thereof against the mounting plate in electrically insulated relationship therewith.
Claims22
A circuit arrangement comprising at least one mounting plate, at least one chip-form component to be cooled, which is disposed on the mounting plate, contact surface means on the mounting plate, connecting means electrically conductively connecting the chip-form component to associated contact surface means, a cooling member on which the at least one mounting plate is arranged, and a pressing arrangement adapted to press the at least one mounting plate against the cooling member, the pressing arrangement including at least one mounting element which is stable in respect of heat and shape and a pressing means comprising a cushion element of electrically insulating, elastically yielding material on the side of the mounting element which is towards the cooling member and adapted to press against at least one of the chip-form component and the mounting plate in electrically insulated relationship in the vicinity thereof, further including at least one bridge element associated with the cushion element to delimit same at least at one side, the bridge element comprising a material which is stable in respect of heat and shape.
A circuit arrangement comprising at least one mounting plate, at least one chip-form component to be cooled, which is disposed on the mounting plate, contact surface means on the mounting plate, connecting means electrically conductively connecting the chip-form component to associated contact surface means, a cooling member on which the at least one mounting plate is arranged, and a pressing arrangement adapted to press the at least one mounting plate against the cooling member, the pressing arrangement including at least one mounting element which is stable in respect of heat and shape and a pressing means comprising a cushion element of electrically insulating, elastically yielding material on the side of the mounting element which is towards the cooling member and adapted to press against at least one of the chip-form component and the mounting plate in electrically insulated relationship in the vicinity thereof, further including
- at least one bridge element associated with the cushion element to delimit same at least at one side, the bridge element comprising a material which is stable in respect of heat and shape,
- a substrate disposed on the cooling member, and at least one connecting element connecting the substrate to the mounting plate, wherein the at least one bridge element is operable to press against the at least one connecting element.
Dependencies are inferred from the claim text.