Moisture relief for chip carrier
AssigneeMotorola, Inc.
InventorsBruce J. Freyman, Frank J. Juskey, Barry M. Miles
Life of this patent
Estimating the term…
Abstract
An integrated circuit package (10) comprises a semiconductor die (14) having a top surface and a bottom surface, and a substrate (16) for receiving the semiconductor die. The substrate should have an aperture(s) (18) below the semiconductor die for providing moisture relief during temperature excursions. An adhesive (20) applied to the substrate allows for mounting the semiconductor die to the substrate. Then, the semiconductor die is wirebonded to the substrate. Finally, an encapsulant (12) for sealing the top surface of the semiconductor die is formed over the semiconductor die and portions of the substrate.
Claims12
An overmolded pad array chip carrier package, comprising:
- a semiconductor die;
- a printed circuit board substrate for receiving said semiconductor die, said printed circuit board substrate having first and second opposed major surfaces and said substrate having at least one hole below said die;
- an adhesive applied to said printed circuit board substrate for mounting said semiconductor die to said printed circuit board substrate, at least a portion of said adhesive filling at least a portion of said hole;
- at least one wirebond from said printed circuit board substrate to said semiconductor die;
- an overmolded epoxy cover encapsulating said semiconductor die, said at least one wirebond, and portions of said printed circuit board substrate first surface so as to expose said portion of said adhesive to an environment.
An integrated circuit package, comprising:
- a semiconductor die having a top surface and a bottom surface;
- a printed circuit substrate for receiving said semiconductor die, said printed circuit substrate having a die mounting area with a hole extending through the printed circuit substrate;
- an adhesive applied to the printed circuit substrate for mounting said semiconductor die to said printed circuit substrate, a portion of said adhesive at least partially filling said hole;
- at least one wirebond from said printed circuit substrate to said semiconductor die,
- a glob top encapsulant for sealing the top surface of said semiconductor die, said wirebonds and only an upper surface of said printed circuit substrate.
A chip carrier package, comprising:
- a semiconductor die having a perimeter;
- a printed circuit board for receiving said semiconductor die, said printed circuit board having first and second opposed major surfaces and having at least one hole within an area bounded by said semiconductor die perimeter;
- an adhesive applied to said first major surface for mounting said semiconductor die to said printed circuit board, said adhesive filling at least a portion of said hole;
- at least one wirebond from said printed circuit board to said semiconductor die;
- an over molded cover encapsulating said semiconductor die, said at least one wirebond, portions of said printed circuit board first surface, and arranged so as to leave a portion of said hole in said second major surface exposed.
Dependencies are inferred from the claim text.