Semiconductor device with a plurality of face to face chips

A semiconductor device comprising a plurality of semiconductor chips;

• electrodes formed on circuit surfaces of said plurality of semiconductor chips;
• inner leads comprised of a metal foil and bonded at first ends thereof to said electrodes;
• outer leads each having a predetermined surface at a first end thereof bonded to a second end of at least one of said inner leads;
• and a sealing material sealing said plurality of semiconductor chips, said electrodes, said inner leads, and part of each of said outer leads;
• wherein said semiconductor chips are laminated in such a manner that those surfaces of said semiconductor chips on which their respective circuits are not formed are disposed in facing relation wherein all of the outer leads are part of a lead frame having a first surface facing in a first direction and a second surface facing in a second direction opposite to said first direction, wherein all of the predetermined surfaces of the outer leads are formed on only one of the first and second surface of the lead frame, and wherein the inner leads are connected to the outer leads only at said predetermined surfaces of the outer leads, whereby the inner leads can be connected by bonding between the electrodes of the plurality of semiconductor chips and the outer leads without having to invert the lead frame.

A semiconductor device comprising a plurality of semiconductor chips;

• electrodes formed on circuit surfaces of said plurality of semiconductor chips;
• inner leads comprised of a metal foil and bonded at one ends thereof to said electrodes;
• outer leads each having a predetermined surface at a first end thereof bonded to a second end of at least one of said inner leads;
• and a sealing material sealing said plurality of semiconductor chips, said electrodes, said inner leads, and part of each of said outer leads;
• wherein said semiconductor chips are laminated in such a manner that the surface of one of any two adjacent semiconductor chips on which a circuit is formed is disposed in facing relation to that surface of the other semiconductor chip on which a circuit is not formed wherein all of the outer leads are part of a lead frame having a first surface facing in a first direction and a second surface facing in a second direction opposite to said first direction, wherein all of the predetermined surfaces of the outer leads are formed on only one of the first and second surface of the lead frame, and wherein the inner leads are connected to the outer leads only at said predetermined surfaces of the outer leads, whereby the inner leads can be connected by bonded between the electrodes of the plurality of semiconductor chips and the outer leads without having to invert the lead frame.