Automatic reflow apparatus with pressure equalization means
AssigneeEightech Tectron Co., Ltd.
InventorOsamu Yamada
Life of this patent
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AssigneeEightech Tectron Co., Ltd.
InventorOsamu Yamada
Estimating the term…
An automatic soldering apparatus for soldering a printed circuit board includes a plurality of electronic elements mounted thereon to be soldered thereto. The apparatus is structured to have a first station provided with a first outer opening for enabling the printed circuit board to be transported therethrough into a heating chamber so as to be soldered therein and further provided with a first inner opening, a second station provided with a second outer opening for enabling the soldered printed circuit board to be transported therethrough out of the heating chamber, and further provided with a second inner opening, and a duct having one end opening and an opposite end opening, the one end opening being connected to the first inner opening of the first station and the opposite end opening being connected to the second inner opening of the second station, the areas of the first inner opening the one end opening being larger than the area of the first outer opening, and the areas of the second inner opening and the opposite end opening being larger than the area of the second outer opening.
An automatic reflow soldering apparatus for soldering a printed circuit board having a plurality of electronic elements mounted thereon to be soldered thereto by transporting the printed circuit board through a heating chamber having an inert gas filled therein, said apparatus comprising:
An automatic reflow soldering apparatus for soldering a printed circuit board having a plurality of electronic elements mounted thereon to be soldered thereto by transporting the printed circuit board through a heating chamber having an inert gas filled therein, said apparatus comprising:
Dependencies are inferred from the claim text.