Laser processing method for a thin-film structure
AssigneeSiemens Aktiengesellschaft
InventorsStefan Praschek, Wolfgang Riedl, Hans Goslowsky
Life of this patent
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Abstract
A method for eroding material, particularly material in a thin-film structure, that includes at least one thin-film arranged over at least one transparent layer, includes irradiating the thin-film with a laser pulse through the transparent layer. The laser pulse has a wavelength in the absorption region of the thin-film. The irradiated thin-film region, together with any layers lying above the thin-film region, are popped off, without any residue, from the transparent layer.
Claims10
A method for eroding material with a laser including the steps of:
- providing a thin-film structure including at least one thin-film over at least one transparent layer for laser irradiation, said thin-film structure being a thin-film solar cell;
- and
- irradiating said thin-film structure through said transparent layer with a laser pulse having a wavelength in an absorption range of said at least one thin-film for popping said thin-film structure off said at least one transparent layer in a region of said laser pulse and in order to form inactive regions.
A method for eroding material using a laser comprising the steps of:
- providing a thin-film structure including at least one thin-film arranged over at least one transparent layer for laser irradiation, said thin-film structure comprising a solar cell;
- selecting a laser pulse wavelength in an absorption range of said at least one thin-film;
- and
- irradiating said thin-film structure through said at least one transparent layer with a laser pulse for popping said thin-film structure off said at least one transparent layer in a region of said laser pulse and to form inactive layer regions in said thin-film structure.
Dependencies are inferred from the claim text.