Device having a multi-layered conductor structure
AssigneeKabushiki Kaisha Toshiba
InventorsToshiya Kiyota, Mitsushi Ikeda, Meiko Ogawa, Yoshifumi Ogawa, Michio Murooka
Life of this patent
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Abstract
A multi-layered conductor structure device has a substrate, a first conductor layer formed on the substrate, which provides an electrode or wiring, and an insulating film covering the first conductor layer and the substrate. On the insulating film, a second conductor layer is formed which comprises an indium tin oxide, and which provides an electrode or wiring. The first conductor layer is formed of an alloy of aluminum with copper, gold, boron, bismuth, cobalt, chromium, germanium, iron, molybdenum, niobium, nickel, palladium, platinum, tantalum, titanium, tungsten, and/or silver.
Claims19
A device having a multi-layered conductor structure comprising:
- a substrate;
- a first conductor layer formed on the substrate, which provides an electrode or wiring;
- an insulating film covering the first conductor layer and the substrate;
- and
- a second conductor layer formed on the insulating film, and comprising an indium tin oxide, which provides an electrode or wiring;
- wherein said first conductor layer is formed of an alloy of aluminum with at least one element selected from copper, gold, boron, bismuth, cobalt, chromium, germanium, iron, molybdenum, niobium, nickel, palladium, platinum, tantalum, titanium, tungsten, and silver.
A driving circuit board for liquid crystal display device comprising:
- a substrate;
- a first conductor layer formed on the substrate, which provides an electrode or wiring;
- an insulating film covering the first conductor layer and the substrate;
- and
- a second conductor layer formed on the insulating film, and comprising an indium tin oxide, which provides an electrode or wiring;
- wherein said first conductor layer is formed of an alloy of aluminum with at least one element selected from copper, gold, boron, bismuth, cobalt, chromium, germanium, iron, molybdenum, niobium, nickel, palladium, platinum, tantalum, titanium, tungsten, and silver.
A device having a multi-layered conductor structure comprising:
- a substrate;
- a first conductor patterned layer formed on the substrate, which provides an electrode or wiring, said first conductor layer comprising an alloy of aluminum with at least one element selected from copper, gold, boron, bismuth, cobalt, chromium, germanium, iron, molybdenum, niobium, nickel, palladium, platinum, tantalum, titanium, tungsten, and silver;
- an insulating film covering the first conductor layer and the substrate;
- and
- a second conductor patterned layer formed on the insulating film, and comprising an indium tin oxide, which provides an electrode or wiring, said second conductor patterned layer having been patterned with an indium tin oxide-etching layer after said first conductor patterned layer and said insulating film have been formed on said substrate.
Dependencies are inferred from the claim text.