Fabrication method for vacuum microelectronic devices
AssigneeInternational Business Machines Corporation
InventorsRobert R. Wilbarg, Claude Johnson, Jr.
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Abstract
A fabrication method for a microstructure having a vacuum sealed cavity therein including the process steps of forming an aluminum filled cavity in a body of silicon material and heating the structure such that the aluminum is absorbed into the silicon material leaving a vacuum in the cavity. In one embodiment of the invention a cavity is etched into a silicon wafer and filled with aluminum. A silicon dioxide layer is formed over the aluminum filled cavity and the structure is heated to produce the vacuum cavity.
Claims5
A method for fabricating a microstructure incorporating a vacuum cavity therein comprising the steps of:
- Step 1 forming a body of silicon material having an enclosed cavity therein filled with aluminum,
- Step 2 heating said body of silicon material containing said aluminum filled cavity to cause said aluminum in said cavity to be absorbed into said body of silicon material and leave a vacuum remaining in said cavity.
Dependencies are inferred from the claim text.