Method of manufacturing electronic components
AssigneeMurata Manufacturing Co., Ltd.
InventorsYasuto Inagaki, Yoshiaki Kohno
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Abstract
A method for efficiently forming external electrodes of desired thicknesses on chip electronic components such as multilayer ceramic capacitors. Cutting grooves are formed in a block along surfaces to be provided with external electrodes. The block is divided into individual chips after metal paste for forming external electrodes is cast into the cutting grooves and dried. The metal paste filling up each of the cutting grooves is cut with a blade to be divided into two parts. The two parts of the metal paste thus formed with the blade define external electrodes. The present invention can also be applied to form external electrodes in an electronic component array comprising a plurality of electronic component elements.
Claims11
A method of manufacturing chip electronic components comprising the steps of:
- preparing a block, said block being capable of providing a plurality of chip electronic components, each of said chip electronic components having end surfaces;
- forming cutting grooves in said block, said cutting grooves being formed along said end surfaces of said chip electronic components;
- applying metal paste for forming external electrodes, said metal paste being applied into each of said cutting grooves to fill up said cutting grooves;
- and
- cutting said metal paste filling up each of said cutting grooves so as to divide said metal paste in each of said cutting groove into two parts, whereby external electrodes are provided on each of said end surfaces of each of said chip electronic components.
A method of manufacturing an electronic component array comprising a plurality of electronic component elements, said method comprising the steps of:
- preparing a block, said block being capable of providing a plurality of electronic component elements and a carrier part disposed below said electronic component elements, said carrier part holding said electronic component elements together with spaces defined therebetween and each of said electronic component elements having end surfaces;
- forming grooves in said block, said grooves being formed along said end surfaces of said electronic component elements so as not to reach said carrier part;
- applying metal paste for forming external electrodes, said metal paste being applied into each of said grooves to fill up said grooves;
- and
- cutting said metal paste filling up each of said grooves so as to divide said metal paste in each of said cutting grooves into two parts, whereby external electrodes are provided on each of said end surfaces of each of said chip electronic component elements.
Dependencies are inferred from the claim text.