Loading patent…
AssigneeHitachi, Ltd.
InventorsMakoto Kitano, Asao Nishimura, Akihiro Yaguchi, Nae Yoneda, Maya Obata, Ryuji Kohno, Mitsuaki Haneda
Estimating the term…
A plastic-molded-type semiconductor device having a high degree of integration encases a plurality of semiconductor chips in a package unit with each chip situated perpendicular to the substrate for mounting. On a surface of each chip containing circuits or on a reverse surface of the same, a lead frame is attached with an insulating material interposed therebetween. The chip and lead frame are connected with each other by using wire. The lead frame is arranged perpendicularly to another lead frame provided in parallel and connected therewith by welding. A printed circuit board may be used in place of said latter lead frame. By arranging the chips in projections made of resin, the thermal resistance of the semiconductor device is decreased. The present invention is particularly effective for a memory IC.
A plastic-molded-type semiconductor device including a plurality of semiconductor chips, lead frames having outside lead groups and inside lead groups, and connecting members for electrically connecting said semiconductor chips with said lead frames, a part of said lead frames, said semiconductor chips and said electrical connecting members being plastic-molded in a package unit, wherein
A plastic-molded-type semiconductor device including a plurality of semiconductor chips, lead frames having outside lead groups and inside lead groups, and connecting members for electrically connecting said semiconductor chips with said lead frames, a part of said lead frames, said semiconductor chips and said electrical connecting members being plastic-molded in a package unit, wherein
A plastic-molded-type semiconductor device including a plurality of semiconductor chips, lead frames having outside lead groups and inside lead groups, and connecting members for electrically connecting said semiconductor chips with said lead frames, a part of said lead frames, said semiconductor chips and said electrical connecting members being plastic-molded in a package unit, wherein
A plastic-molded-type semiconductor device including a plurality of semiconductor chips, lead frames having-outside lead groups and inside lead groups, and connecting members for electrically connecting said semiconductor chips with said lead frames, a part of said lead frames, said semiconductor chips and said electrical connecting members being plastic-molded in a package unit, wherein
The plastic-molded-type semiconductor device according to 5, wherein said plurality of semiconductor chips are arranged substantially perpendicular to a principal plane of said second lead frame group.
A method of producing a plastic-molded-type semiconductor device, comprising the steps of
Dependencies are inferred from the claim text.