IC package having direct attach backup battery
AssigneeSGS-Thomson Microelectronics S.A.
InventorMichael J. Hundt
Life of this patent
Estimating the term…
Loading patent…
AssigneeSGS-Thomson Microelectronics S.A.
InventorMichael J. Hundt
Estimating the term…
A molded device package supports a volatile memory chip and a replaceable backup battery for preserving data in the event of loss of main power supply. The package includes an external socket for receiving a replaceable backup battery which can be manually inserted into or removed from the socket after molding encapsulation and metal trim work have been completed. The socket is intersected by an exposure cavity which permits the positive and negative terminals of a backup battery to engage positive and negative finger leads. The positive and negative battery terminals are engaged by resilient terminal contact portions of the positive and negative finger leads which project into the exposure cavity. Socket shoulder portions and a retainer cap hold a backup battery within the socket and in electrical contact with the resilient terminal contact portions.
A package for containing a semiconductor integrated circuit comprising:
An integrated circuit device package assembly comprising:
In an integral electronic circuit package of the type including a circuit device having multiple input/output nodes encapsulated within a body of nonconductive material, a plurality of connector pins mounted on said body of nonconductive material and projecting externally thereof, and a plurality of conductive finger leads encapsulated within said body of nonconductive material electrically connecting said input/output nodes to said connector pins, the improvement comprising:
Dependencies are inferred from the claim text.