Plate for supporting a punched leadframe
AssigneeRohm Co., Ltd.
InventorHiroshi Okumura
Life of this patent
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Abstract
A leadframe support plate, particularly a heater plate, for a wire bonding apparatus comprises a frame supporting face, and a die-pad supporting face for supporting a die pad of a leadframe. The die-pad supporting face is formed with at least one burr receiving groove extending along the marginal contour of the die pad, so that the die pad of the leadframe is supported stably on the die-pad supporting face even if the marginal of the die pad has burrs.
Claims6
A leadframe support plate for directly supporting a punched leadframe at the time of wire bonding, the support plate comprising a frame supporting face, and a die-pad supporting face for supporting a die pad of the leadframe, the die pad having marginal burrs along a marginal contour of the die pad,
- wherein the die-pad supporting face is formed with at least one burr receiving groove extending along the marginal contour of the die pad for receiving the marginal burrs.
A heater plate for directly supporting a punched leadframe at the time of wire bonding while also heating the leadframe, the heater plate comprising a frame supporting face, and a die-pad supporting face for supporting a die pad of the leadframe, the die pad having marginal burrs along a marginal contour of the die pad,
- wherein the die-pad supporting face is formed with at least one burr receiving groove extending along the marginal contour of the die pad for receiving the marginal burrs.
Dependencies are inferred from the claim text.