US 5,294,827 AGranted

Semiconductor device having thin package body and method for making the same

AssigneeMotorola, Inc.

InventorMichael B. McShane

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Abstract

A thin semiconductor device (50) can be cost effectively manufactured using conventional wire bonding technology and stamped leadframes. A flagless leadframe (12) is utilized in one embodiment. A support tape (14) having a die support surface (20) is attached transversely to a plurality of leads (18) of the leadframe. A semiconductor die (16) is attached on its active surface to the die support surface such that the active surface is coplanar with the leadframe. Low loop wire bonds (24) electrically connect the die to the leadframe. A resin encapsulant package body (52) is molded around the active surface of the die, the wire bonds, and a portion of the leads. An inactive surface of the die is exposed for enhanced thermal dissipation in addition to enabling a thin package body. External lead configuration of the semiconductor device is not limited.

Claims14

Dependent claims

A semiconductor device comprising:

a leadframe having a surface and plurality of leads, each lead having a length and a surface;
an electrically nonconductive support tape attached to a portion of the surface of the leadframe, the electrically nonconductive support tape having a die support surface;
a semiconductor die having an active surface with a plurality of bonding pads thereon and an inactive surface, wherein the semiconductor die is attached to the die support surface of the electrically nonconductive support tape in a manner that positions the active surface of the semiconductor die substantially coplanar with the surface of the plurality of leads, the active surface of the semiconductor die being larger than the die support surface so that the plurality of bonding pads are exposed;
wherein an inner portion of the plurality of leads extend toward and terminate proximally to a perimeter of the semiconductor die:
a plurality of wire bonds electrically connecting the plurality of bonding pads on the active surface of the semiconductor die to the surface of the plurality of leads of the leadframe;
and
a resin package body protecting the plurality of wire bonds, the active surface of the semiconductor die and a portion of the length of the plurality of leads, wherein the portion of the length is completely encapsulated by the resin package body.

4 more elements

A semiconductor device comprising:

a leadframe having a surface and plurality of leads, each lead having a length and a surface;
an electrically nonconductive support tape attached to a portion of the surface of the leadframe including transversely to the length of the plurality of leads, the electrically nonconductive support tape having a die support surface in a window frame configuration;
a semiconductor die having an active surface with a plurality of bonding pads thereon and an inactive surface, wherein the semiconductor die is attached to the die support surface of the electrically nonconductive support tape in a manner that positions the active surface of the semiconductor die substantially coplanar with the surface of the plurality of leads, the active surface of the semiconductor die being larger than the die support surface such that the plurality of bonding pads are exposed wherein an inner portion of the plurality of leads extend toward and terminate proximally to a perimeter of the semiconductor die:
a plurality of wire bonds electrically connecting the plurality of bonding pads on the active surface of the semiconductor die to the surface of the plurality of leads of the leadframe;
and
a resin package body protecting the plurality of wire bonds, the active surface of the semiconductor die and a portion of the length of the plurality of leads, wherein the portion of the length is completely encapsulated by the resin package body.

3 more elements

Dependencies are inferred from the claim text.