Ceramic packages and ceramic wiring board
AssigneeNGK Insulators, Ltd.
InventorsHiroaki Sakai, Shinsuke Yano, Takao Soma, Manabu Isomura
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Abstract
A ceramic package for containing a semiconductor chip including a heat radiating plate, a base plate for wiring, and a ceramic package for containing a semiconductor chip. The package contains a ceramic board, a ceramic cap and a metal lead frame. The heat radiating plate and the ceramic board are made of silicon nitride sintered body, which is characterized in that the number of grain boundaries per a 10 .mu.m straight line drawn in an arbitrary section of the sintered (polycrystal) body is 20 or fewer.
Claims7
A ceramic package for containing a semiconductor chip, comprising:
- a wiring board comprising a first wire distribution for transferring electrical signals and a second wire distribution for power supply;
- and
- a heat radiating plate for mounting a semiconductor chip thereon, said heat radiating plate being coupled to said wiring board and comprising silicon nitride, wherein said heat radiating plate has not more than 20 grain boundaries per a 10 .mu.m straight line extending along an arbitrary section of said heat radiating plate.
A ceramic package for containing a semiconductor chip, comprising:
- a ceramic base for mounting a semiconductor chip thereon, said ceramic base being a silicon nitride sintered body, wherein said ceramic base has not more than 20 grain boundaries per a 10 .mu.m straight line extending along an arbitrary section of said ceramic base;
- a ceramic cap covering said ceramic base and being connected to said ceramic base by a glass or resin agent to seal the semiconductor chip in the ceramic package;
- and
- a metal lead frame arranged between the ceramic base and said ceramic cap.
A ceramic package containing a semiconductor chip, comprising:
- a ceramic base for mounting a semiconductor chip thereon, said ceramic base being a silicon nitride sintered body, said ceramic base comprising not more than 0.3 wt % of aluminum when calculated as alumina;
- a ceramic cap covering said ceramic base and being connected to said ceramic base by a glass or resin agent to seal the semiconductor chip in the ceramic package;
- and
- a metal lead frame arranged between said ceramic base and said ceramic cap.
Dependencies are inferred from the claim text.