Process for preparing printed-circuit board

A process for preparing a printed circuit board, which comprises successive steps of subjecting a printed-circuit copper-clad, laminated base plate to a corrosion-preventing treatment after cladding or laminating, coating a photosensitive electrodeposition coating composition onto the resulting printed-circuit copper-clad, laminated base plate to form a photosensitive resist film, applying a pattern mask onto the photosensitive resist film, exposing the photosensitive resist film through the pattern mask to an actinic ray, developing the resulting photosensitive resist film, etching away a deposited copper foil in the non-circuit area and removing the resulting film on the circuit pattern, said corrosion-preventing treatment being carried out by a process which comprises contacting the printed-circuit copper-clad, laminated base plate with at least one nitrogen-containing heterocyclic compound selected from a group consisting of the compounds represented by the following general formulas (A) to (D):

• ##STR5## wherein R.sub.1 and R.sub.2 each represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms;
• ##STR6## wherein R.sub.3 and R.sub.4 each represents hydrogen atom, a hydroxyl group or an alkyl group having 1 to 6 carbon atoms;
• ##STR7## wherein R.sub.5 represents a hydrogen atom, a chlorine atom or an alkyl group having 1 to 6 carbon atoms;
• and ##STR8## wherein X represents a hydrogen atom or a hydroxyl group, and R.sub.6, R.sub.7 and R.sub.8 each represents a hydrogen atom, a chlorine atom or an alkyl group having 1 to 6 carbon atoms.