Process for the formation of a conductive circuit pattern

A process for the formation of a conductive circuit pattern, which comprises the following steps:

• providing a second base metal layer on a first base metal layer formed on a substrate;
• providing on the second base metal a plating resist in a pattern corresponding to the circuit to be formed and then forming a circuit pattern by plating;
• treating the plating resist with a stripper and then with a stripping residue remover to cut off chemical bonds in the resist by a dehydrating decomposition reaction;
• treating, as a first etching step, the second base metal layer with an etchant for the second base metal layer, whereby the second base metal layer and any resist residue are removed;
• and
• etching, as a second etching step, the first base metal layer with an etchant for the first base metal layer subsequent to the first etching step.

A process for the formation of a conductive circuit pattern on a base metal formed on a substrate, which comprises the following steps:

• providing on the base metal a plating resist in a pattern corresponding to the circuit to be formed and then forming a circuit pattern by plating;
• treating the plating resist with a resist remover to cut off chemical bonds in the resist by a dehydrating decomposition reaction;
• and
• treating the base metal with an etchant for the base metal whereby any resist remaining after the treatment with the resist remover is removed and the base metal is etched at areas which have been covered by the plating resist.