Integrated circuit package
AssigneeNgk Spark Plug Co., Ltd.
InventorsYukihiro Kimura, Nobuhiko Miyawaki, Masao Kuroda
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Abstract
The present integrated circuit package provides both a high density of conductor poles, and reduced crosstalk noises between the conductor poles. The conductor poles are received within holes in an insulating substrate. The insulating substrate has a laminated, multi-layer ceramic substrate structure comprising insulating plates having metallized layers thereon which constitute a portion of the walls of the holes. In addition, insulating layers for insulating the metallized layers from the conductor poles are formed within a selected number of the holes.
Claims16
An integrated circuit package comprising;
- an insulating substrate having a laminated structure including a plurality of insulating plates, said substrate defining a plurality of holes for receiving conductor poles;
- metallized layers configured to shield said conductor poles from each other, said metallized layers being on said insulting plates;
- and
- insulating layers for insulating said metallized layers from said conductor poles, said insulating layers being located to be between said metallized layers and said conductor poles.
An integrated circuit package comprising:
- an insulating substrate defining a plurality of holes, each hole having
- a metallized layer, and
- an insulating layer on the metallized layer.
Dependencies are inferred from the claim text.