Semiconductor device and lead frame used therein

A semiconductor device comprising:

• a lead frame comprising,
• a first heat sink having a peripheral area and a central projected land, said first heat sink having a relatively good heat radiating characteristic, and
• a plurality of inner leads, each having an inner end superimposed on said peripheral area of the first heat sink by an electrically insulating material;
• a semiconductor chip having a chip surface on which a junction pattern is arranged, said semiconductor chip mounted on said central projected land of the first heat sink by an electrically insulating adhesive so that said chip surface faces said projected land;
• TAB leads for electrically connecting said junction pattern of said semiconductor chip to said inner leads;
• and
• a sealing resin hermetically sealing semiconductor chip, said first heat sink, said TAB leads and said inner leads.