Bonding wire inspection apparatus
AssigneeKabushiki Kaisha Shinkawa
InventorKenji Sugawara
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Abstract
An apparatus for inspecting, for example, balls and crescents of wires bonded between a semiconductor chip and a lead frame including an optical system installed above an object of inspection, a vertical illuminator that illuminates the object of inspection, a CCD camera which has a photoelectric converter element provided at an imaging level of the optical system, and X, Y and Z tables which move the CCD camera in the X, Y and Z directions. Since only the photoelectric converter element of the CCD camera is movable in the X, Y and Z directions when focusing is made into the object of inspection, the size of the X, Y and Z tables can be small, and in addition, since the optical system and vertical illuminator are not movable, dirt is prevented from falling onto the object of inspection.
Claims2
A bonding wire inspection apparatus characterized in that said apparatus comprises:
- an optical system installed above an object of inspection, an illumination means which illuminates said object of inspection, a photoelectric converter element which is provided at the imaging level of said optical system, and an X-Y table which moves only said photoelectric converter element in the X and Y directions.
A bonding wire inspection apparatus characterized in that said apparatus comprises an optical system installed above an object of inspection, an illumination means which illuminates said object of inspection, a photoelectric converter element which is provided at the imaging level of the optical system, and an X-Y-Z table which moves only said photoelectric converter element in the X, Y and Z directions.
Dependencies are inferred from the claim text.