An active phased array antenna panel for radiating both heat and arbitrarily polarized microwave signal power comprising;
- a plurality of electronics modules, each of said electronics module including electronic circuit means comprising a plurality of electronic components including an amplifying means for amplifying microwave signal power, a phase shifting means for changing the phase of microwave signals, an attenuating means for attenuating microwave signals, and a digital control means for controlling said amplifying means, said phase shifting means and said attenuating means, a first multilayered circuit board made of a dielectric material with high thermal conductivity to which said electronic circuit means are attached in an electrical and heat conducting relationship, a housing made of a material with high thermal conductivity to which said first multilayered circuit board is attached in an electrical and heat conducting relationship, a plurality of input and output connector means attached to said housing and electrically connected to said electronic circuit means, a thermal contact pad made of dielectric material with high thermal conductivity, means for attaching said thermal contact pad to said housing in an electrical insulating and heat conducting relationship;
- a plurality of subarray elements, each of said subarray element comprising a plurality of patch radiators, each of said patch radiator comprising a first mirror bonded to the top exterior surface of a patch substrate made of a thermally stable low dielectric constant material, a second multilayered circuit board made of a dielectric material with high thermal conductivity, said second multilayered circuit board including a microstrip feed network and a ground plane common to said microstrip feed network and to respective ones of said plurality of patch radiators, said microstrip feed network adapted to receive microwave signal power from said electronics module, said ground plane including a plurality of coupling slots for coupling said microwave signal power from said microstrip feed network through said ground plane to respective ones of said plurality of patch radiators, a second mirror having a plurality of areas with reflective coating removed corresponding in shape with respective ones of said plurality of patch radiators, means for bonding a plurality of said patch radiators to the top surface of said second mirror such that said plurality of patch radiators are aligned to respective ones of said plurality of areas with reflective coating removed, means to bond said second multilayered circuit board to the bottom surface of said second mirror such that said plurality of coupling slots are aligned to respective ones of said plurality of patch radiators;
- a support structure assembly comprising a lightweight lower support structure made of a material with high electrical and thermal conductivity, a third mirror bonded to the bottom exterior surface of said lightweight lower support structure, a third multilayered circuit board comprising a plurality of imbedded transmission line layers for distributing microwave power, DC bias power, and control signals to respective ones of said plurality of electronics modules, a plurality of output connectors to receive input connectors on respective ones of said plurality of electronics modules, a plurality of holes in said third multilayered circuit board for receiving respective ones of said plurality of thermal contact pads on said electronics modules, a lightweight upper support structure made of a material with high electrical and thermal conductivity, said lightweight upper support structure including a plurality of holes corresponding in shape and adapted to receive respective ones of said plurality of electronics modules, means for attaching said third multilayered circuit board to the top surface of said lightweight lower support structure and to the bottom surface of said lightweight upper support structure to form a composite assembly,
- means for attaching said plurality of electronics modules to said support structure assembly in an electrical and heat conducting relationship, means for attaching said plurality of subarray elements to respective ones of said plurality of electronics modules in an electrical and heat conducting relationship.