Method and apparatus for measuring nonlinearity in thin film heads during their fabrication
OwnerDonald E. Horne, Prakash Kasiraj +1inventors
InventorsDonald E. Horne, Prakash Kasiraj, Fior D. Sargent
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Abstract
At the wafer level, a conventional write signal is applied to a pre-selected thin film head. Thereafter, first and second constant amplitude, differing frequency sine wave signals are applied to the head along with a DC bias signal whose magnitude is varied. The level of frequency mixing in the output signal of the head is detected at each level of magnitude of the DC bias signal and this data is utilized in predicting the level of noise in the read-back signal of the thin film head during normal read and write operations in connection with a rotating storage disk.
Claims23
A method of measuring variations in the nonlinearity of a recording head representative of the expected noise in the read-back signal of the head during normal read and write operations comprising the steps of:
- applying an oscillating signal to a coil of head;
- applying a DC signal to the coil along with the oscillating signal;
- varying the magnitude of the DC signal while maintaining an amplitude of the oscillating signal substantially constant;
- and
- detecting a level of distortion in an output signal of the coil representative of a level of expected noise in the read-back signal of the head during normal read and write operations.
A method of measuring variations in the nonlinearity of an inductive thin film head representative of the expected noise in the read-back signal of the head during normal read and write operations in connection with a rotating storage disk, comprising the steps of:
- applying first and second substantially constant amplitude oscillating signals having different frequencies to a coil of an inductive thin film head;
- applying a DC bias signal to the coil along with the oscillating signals;
- varying the magnitude of the DC bias signal;
- and
- detecting a level of frequency mixing in an output signal of the coil representative of a level of expected noise in the read-back signal of the head during normal read and write operations in connection with a rotating storage disk.
A method of measuring the variations of nonlinearity of an inductive thin film head representative of the expected noise in the read-back signal of the head during normal read and write operations in connection with a rotating storage disk, comprising the steps of:
- positioning a wafer having a plurality of inductive thin film heads formed thereon in a wafer prober machine;
- causing a set of probes of the wafer prober machine to contact a pair of coil connectors of a selected head on the wafer;
- applying a write signal to a first one of the coil connectors of the head for a first predetermined interval;
- during a second predetermined interval simultaneously applying to the first coil connector first and second constant amplitude sine wave signals at 10.45 Mhz and 0.25 Mhz, respectively, along with a DC bias signal;
- during the second interval, increasing the DC bias signal from minus 1000 microamperes to plus 1000 microamperes in 100 microamper steps;
- at each step of DC bias signal, filtering an output signal on a second one of the coil connectors to remove all but a 10.7 Mhz component thereof;
- determining a minimum value of the 10.7 Mhz component and a maximum value of the 10.7 Mhz component;
- and
- comparing a difference in the minimum and maximum values of a 10.7 Mhz component to a predetermined threshold value and rejecting the head if the difference exceeds the threshold value.
An apparatus for measuring variations in the nonlinearity of a thin film head representative of the expected noise in the read-back signal of the head during normal read and write operations in connection with a rotating storage disk, comprising:
- means for supporting a wafer having formed thereon a plurality of thin film heads and for selectively contacting the coil connectors of a selected head on the wafer;
- signal generator means connected to the wafer supporting and contacting means for applying an oscillating signal to a coil of the selected head;
- sweep circuit means connected to the wafer supporting and connecting means for applying a variable magnitude DC signal to the coil of the selected head along with the oscillating signal;
- and
- means connected to the wafer supporting and contacting means for detecting a level of distortion in an output signal of the coil representative of a level of expected noise in the read-back signal of the head during normal read and write operations in connection with a rotating storage disk.
Dependencies are inferred from the claim text.