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US 5,293,069 AGranted
Ceramic-glass IC package assembly having multiple conductive layers
AssigneeNgk Spark Plug Co., Ltd.
InventorsNaomiki Kato, Kazuyuki Maruyama
Life of this patent
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Abstract
A ceramic base of an IC package has a laminated structure and has two conductive layers sandwiched between insulating ceramic layers. One of the conductive layers is used as a power source layer and electrically connects a plurality of power source terminals of an IC chip to a single power source lead. The other conductive layer is used as an earth layer and electrically connects a plurality of earth terminals of the IC chip to a single earth lead.
Claims20
An IC package assembly comprising:
- a ceramic base having a laminated structure including first and second conductive layers;
- an IC chip installed on said base and having a plurality of power source terminals electrically connected to said first conductive layer by wire bonding and a plurality of earth terminals connected to said second conductive layer by wire bonding;
- a first external lead electrically connected to said first conductive layer to serve as a power source lead;
- a second external lead electrically connected to said second conductive layer to serve as an earth lead;
- first sealing glass means for securing said first and second external leads to said base;
- a closure member;
- and
- second sealing glass means for securing said closure member to said base and hermetically sealing said IC chip;
- said first sealing glass means further comprising a sheet of first low temperature glass having a pair of openings filled with silver glass for electrically connecting said first and second external leads to said first and second conductive layers, respectively.
6 more elements
An IC package assembly comprising:
- a ceramic base having a laminated structure including first and second conductive layers;
- an IC chip installed on said base and having a plurality of power source terminals electrically connected to said first conductive layer and a plurality of earth terminals connected to said second conductive layer;
- a first external lead electrically connected to said first conductive layer to serve as a power source lead;
- a second external lead electrically connected to said second conductive layer to serve as an earth lead;
- first sealing glass means for securing said first and second external leads to said base;
- and
- a closure member secured to said base for hermetically sealing said IC chip, said closure member consisting of a frame secured to said base by means of second sealing glass and a cover secured to said frame by means of third sealing glass means, said base and said second sealing glass means cooperating to define cavities extending between said first and second external leads and said first and second conductive layers, respectively, and receiving bonding ires electrically connecting therebetween, said cavities having top ends defined by said frame.
4 more elements
Dependencies are inferred from the claim text.