Solder interconnection structure on organic substrates and process for making
AssigneeInternational Business Machines Corporation
InventorsRichard Hsiao, Jack M. McCreary, Voya R. Markovich, Donald P. Seraphim
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Abstract
Solder interconnection whereby the gap created by solder connections between an organic substrate and semiconductor device is filled with a composition obtained from curing a thermosetting preparation containing a thermosetting binder; and filler having a maximum particle size of 50 microns.
Claims7
A method of providing solder interconnections between a semiconductor device and a supporting organic substrate comprising attaching said device to said organic substrate by a plurality of solder connections that extend from the supporting substrate to electrodes on said semiconductor device to form a gap between said supporting substrate and said semiconductor device;
- filling said gap with a composition that contains:
- A. a curable thermosetting binder said binder having a viscosity at room temperature of no greater than about 1,000 centipoise;
- B. filler having a maximum particle size of 50 microns wherein the amount of A is about 60 to about 25 percent by weight of the total of A and B, and correspondingly the amount of B is about 40 to about 75 percent by weight based upon the amount of A and B;
- and curing said composition.
Dependencies are inferred from the claim text.