Ceramic substrate having wiring of silver series
AssigneeNEC Corporation
InventorsKeiichiro Kata, Yuzo Shimada
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Abstract
A ceramic substrate comprises a ceramic body and a wiring pattern made of silver series selectively formed on the major face of the ceramic body. The ceramic body contains silver particles of 0.1 to 2.5 percents.
Claims8
A ceramic substrate comprising:
- a ceramic body having a major face and consisting essentially of alumina and glass;
- silver particles having a 1 to 5 .mu.m diameter and being dispersed substantially uniformly in said ceramic body;
- and
- a wiring layer formed on said major face of said ceramic body and being made of silver or a material containing silver;
- wherein;
- in every portion of said ceramic body, the weight percentage of said silver particles is 0.1% or more, to stabilize the specific resistance of said wiring layer, and is 2.5% or less, to preserve the insulating characteristics of said ceramic body.
A ceramic substrate comprising a ceramic body, said ceramic body comprising a plurality of ceramic insulating layers stacked up to each other, each of said ceramic insulating layers containing silver particles and having upper and lower faces, and a wiring pattern made of silver or material containing silver formed on said upper and/or lower faces of said ceramic insulating layers such that one group of wiring layers of said wiring pattern is positioned within said ceramic body, said silver particles being substantially, uniformly dispersed in said ceramic insulating layers so that the weight percentage of said silver particles in every portion of said ceramic insulating layers is 0.1% or more for making the specific resistance of said wiring pattern stable, and is 2.5% or less for preventing a degradation of the insulating characteristics of said ceramic insulating layers.
Dependencies are inferred from the claim text.