Method for forming metallized layer on an aluminum nitride sintered body
AssigneeSumitomo Electric Industries, Ltd.
InventorsAkira Yamakawa, Akira Sasame
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AssigneeSumitomo Electric Industries, Ltd.
InventorsAkira Yamakawa, Akira Sasame
Estimating the term…
An aluminum nitride sintered body that has been fired/formed to have a prescribed sintered configuration, is used as a substrate. A metal paste of tungsten is prepared and applied to the substrate. The metal paste of tungsten contains oxide components of at least 1 percent by weight of the paste and not more than 40 percent by weight of the paste. The oxide components include SiO.sub.2 of at least 1 percent by weight of the oxide components and not more than 40 percent by weight of the oxide components. The oxide components include CaO and Al.sub.2 O.sub.3 in a weight ratio of at least 0.5 and not more than 2 of CaO to Al.sub.2 O.sub.3. The aluminum nitride sintered body coated with the metal paste is heated/fired in a non-oxidizing atmosphere at a temperature of at least 1400.degree. C. and not more than 2000.degree. C.
A method of increasing the peel strength between a metallized layer and a surface of an aluminum nitride sintered body, comprising the steps of:
Dependencies are inferred from the claim text.