Wire bonder

A wire bonder comprising:

• bonding means for bonding a first bonding pad formed on a first semiconductor chip and a second bonding pad formed on a second semiconductor chip by a bonding wire, said bonding means forming a metal ball at a second bonding point on the second bonding pad, cutting the bonding wire at a first cutting point separated from the second bonding point, bonding the bonding wire to a first bonding point on the first bonding pad by ball bonding, extending the bonding wire from the first bonding point to bond the wire to the metal ball by wedge bonding, and cutting the bonding wire at a second cutting point separated from the second bonding point;
• pattern recognition means for detecting the first bonding pad and the second bonding pad;
• shift amount calculation means for calculating amounts of shift of the first bonding pad and the second bonding pad detected by said pattern recognition means from reference locations;
• correction means for correcting locations of the first bonding point, the second bonding point, the first cutting point, and the second cutting point in accordance with the amounts of shift calculated by said shift amount calculation means;
• and
• control means for controlling said bonding means in response to a signal output from said correction means.