Semiconductors structure precision lapping method and system
AssigneeTexas Instruments Incorporated
InventorJane H. Nguyen
Life of this patent
Estimating the term…
Abstract
An apparatus in the form an N.sub.2 gas gun (30) improves the lapping of a semiconductor device (22) by lapping equipment (10) by an associating a predetermined location (32) on the lapping surface (20) with the semiconductor device (22). Compressed N.sub.2 gas flows through a nozzle device (30) to the predetermined location (32) on the lapping surface (20). Nozzle holder (28) holds the N.sub.2 gas gun (30) in a position for the compressed gas to blow particulate from predetermined location (32) prior to the predetermined location (32) associating with the semiconductor device (22).
Claims12
A method for removing particulate from a lapping surface during a semiconductor lapping process, comprising the steps of:
- rotating said lapping surface around a central axis in one direction;
- directing a flow of water to said lapping surface;
- continuously directing, opposite the direction of rotation, a controlled pressurized gas to a predetermined area of the lapping surface to remove the particulate from said predetermined area prior to said predetermined area contacting the semiconductor device and:
- controlling noise associated with directing said controlled pressurized gas to said predetermined area by directing said controlled pressurized gas through a nozzle then through tubing associated with said nozzle, said tubing having a diameter narrower than said nozzle.
An apparatus for improving the lapping of a semiconductor device comprising:
- a substantially circular diamond lapping surface that associates a predetermined location on the lapping surface with the semiconductor device as the lapping surface rotates in one direction around a central axis;
- a water tap for directing a flow of water to said lapping surface;
- a compressed gas;
- a nozzle device for flowing said compressed gas opposite the direction of rotation;
- a nozzle holder for holding said nozzle device in a position for said compressed gas to blow particulate from said predetermined location prior to said predetermined location associating with the semiconductor device and:
- a flow noise attenuator associated with said nozzle device to reduce noise associated with said flow of said compressed gas, said flow noise attenuator having a diameter narrower than said nozzle device.
Dependencies are inferred from the claim text.