System for coupling a high voltage, high current wire to a circuit board

A circuit board system for coupling a high voltage, high current wire to a trace on the circuit board comprising a circuit board having first and second opposed faces and having a high voltage, high current circuit portion including at least one electrically conductive trace on the first face, a terminal for coupling a high voltage, high current wire to the at least one trace comprising a block of electrically conductive material, the block formed generally as a parallelepiped having upper and lower surfaces, and two pairs of opposed sidewalls, a laterally extending bore formed between two opposed sidewalls of a pair, a first threaded bore extending from a surface into communication with the laterally extending bore, a second threaded bore extending from the lower surface into the block, the block having at least one portion depending downwardly from the lower surface, a first threaded member received in the first bore and being adapted to clamp a wire received in the laterally extending bore, a second threaded member formed of electrically conductive material and being formed with a head extending radially therefrom, the circuit board having a bore extending between the first and second faces and being adapted to receive the second threaded member therethrough, the second threaded member being threadingly received in the second threaded bore to attach the block to the second face of the board, and an aperture for each downwardly extending portion extending between the first and second faces and aligned with and receiving therein each respective downwardly depending portion when the second threaded member is disposed in the second threaded bore, the head engaging the at least one electrically conductive trace on the first face of the board forming an electrical coupling from the wire through the block, the second threaded member and the head thereof to the at least one trace.