Semiconductor device having an opening and method of manufacturing the same

A semiconductor device, comprising:

• a substrate in which a semiconductor element is formed;
• an insulating film formed on said substrate;
• an electrode pad formed on said insulating film, said electrode pad being electrically connected to said semiconductor element by a signal line;
• an insulating protective film covering a part of said insulating film, said insulating protective film including an opening through which said electrode pad is connected to an external circuit and an exposing opening provided at a peripheral portion of said electrode pad through which a side of said electrode pad is exposed externally;
• a bump formed at said electrode pad via said opening for an electrode pad connection;
• and
• an inner lead which is connected to said bump, for connecting said external circuit to said electrode pad via said opening for the electrode pad connection.

A method of manufacturing a semiconductor device, comprising the steps of:

• forming an insulating film on a semiconductor substrate in which a semiconductor element is formed;
• forming an electrode pad on said insulating film conductive layer, said electrode pad being electrically connected to said semiconductor element by a signal line;
• forming an insulating protective film for covering a part of said insulating film;
• forming an opening through which said electrode pad is connected to an external circuit;
• forming an exposing opening at a peripheral portion of said electrode pad through which a side of said electrode pad is exposed externally;
• and
• connecting the electrode pad and the external circuit via said opening.