Thermal joint
AssigneeInternational Business Machines Corporation
InventorsPeter A. Gruber, Arthur R. Zingher
Life of this patent
Estimating the term…
Abstract
A thermal joint for transferring heat from a first object to a second object contains a first relatively thick layer of high bulk thermal conductivity material and a second relatively thin layer of lubricant. In a preferred embodiment an anti-adhesion coating is also present in the joint. The thermal joint completely fills the gap between the first and second objects while enabling relative sliding motion to compensate for any lateral distortion.
Claims49
A thermal joint adapted to be disposed between a first heat emitting object and second heat removing object for transferring heat from the first object to the second object while providing compliance for object dimensional variation and thermally induced object variations, the thermal joint comprising:
- a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the heat emitting object, and
- a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the heat removing object;
- wherein said first layer is a solder having a melting temperature in the range between 85.degree. C. and 183.degree. C.
A thermal joint adapted to be disposed between a first heat emitting object and a second heat removing object for transferring heat from the first object to the second object while providing compliance for object dimensional variation and thermally induced object variations, the thermal joint comprising:
- a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the heat emitting object;
- and
- a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the heat removing object;
- wherein said first layer is Bi/Sn solder and said second layer is poly-alyphatic oil.
A thermal joint adapted to be disposed between a first heat emitting object and a second heat removing object for transferring heat from the first object to the second object while providing compliance for object dimensional variation and thermally induced object variations, the thermal joint comprising:
- a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the heat emitting object;
- a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the heat removing object;
- and
- an anti-adhesion coating.
A thermal joint adapted to be disposed between a first emitting object and a second heat removing object for transferring heat from the first object to the second object while providing compliance for object dimensional variation and thermally induced object variations, the thermal joint comprising:
- a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the heat emitting object;
- a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the heat removing object;
- and
- a metal foil layer disposed between said first layer and said second layer.
A thermal joint adapted to be disposed between a first heat emitting object and a second heat removing object for transferring heat from the first object to the second object while providing compliance for object dimensional variation and thermally induced object variations, the thermal joint comprising:
- a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the heat emitting object;
- a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the heat removing object;
- and
- a button layer disposed between said first layer and said second layer, said button layer having a bulk thermal conductivity and thickness greater than that of said first layer.
A thermal joint adapted to be disposed between an electronic component and a cooling means for transferring heat between the component and the cooling means and for compensating for dimensional variations and thermally induced variations of the component, the thermal joint comprising:
- a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the electronic component, and
- a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the cooling means;
- wherein said first layer is eutectic solder.
A thermal joint adapted to be disposed between an electronic component and a cooling means for transferring heat between the component and the cooling means and for compensating for dimensional variations and thermally induced variations of the component, the thermal joint comprising:
- a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the electronic component;
- and
- a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the cooling means;
- wherein said first layer is solder and said second layer is poly-alyphatic oil.
A thermal joint adapted to be disposed between an electronic component and a cooling means for transferring heat between the component and the cooling means and for compensating for dimensional variations and thermally induced variations of the component, the thermal joint comprising:
- a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the electronic component;
- and
- a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the cooling means;
- wherein said second layer is selected from the group consisting of low viscosity poly-aliphatic olefin, mineral oil, silicone oil, synthetic oil, gallium and liquid metal.
A thermal joint adapted to be disposed between an electronic component and a cooling means for transferring heat between the component and the cooling means and for compensating for dimensional variations and thermally induced variations of the component, the thermal joint comprising:
- a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the electronic component;
- a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the cooling means;
- and
- an anti-adhesion coating.
A thermal joint adapted to be disposed between an electronic component and a cooling means for transferring heat between the component and the cooling means and for compensating for dimensional variations and thermally induced variations of the component, the thermal joint comprising:
- a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the electronic component;
- a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the cooling means;
- and
- a metal foil layer disposed between said first layer and said second layer.
A thermal joint adapted to be disposed between an electronic component and a cooling means for transferring heat between the component and the cooling means and for compensating for dimensional variations and thermally induced variations of the component, the thermal joint comprising:
- a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the electronic component;
- a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the cooling means;
- and
- a button layer disposed between said first layer and said second layer, said button layer having a bulk thermal conductivity and thickness greater than that of said first layer.
A thermal joint adapted to be disposed between an electronic component and a cooling means for transferring heat between the component and the cooling means and for compensating for dimensional variations and thermally induced variations of the component, the thermal joint comprising:
- a first layer of high bulk thermal conductivity material adapted to be located in thermal contact with the electronic component;
- a second layer in contact with said first layer, said second layer being a lubricant having a thickness thinner than said first layer, and said second layer being adapted to be located in thermal contact with the cooling means;
- and
- retainer means disposed for positioning said first layer relative to said component.
An electronic assembly including a thermal joint comprising:
- a substrate;
- at least one electronic component attached to said substrate;
- cooling means;
- a thermal joint for transferring heat from said at least one electronic component to said cooling means while providing compliance for manufacturing and for thermally induced variations of said at least one electronic component, said thermal joint comprising:
- a first layer of planarized high thermal conductivity material adapted to be in thermal contact with said at least one electronic component, and
- a second layer of lubricant having a thickness less than that of said first layer, said second layer being adapted to be in thermal contact with said cooling means;
- wherein said second layer is selected from the group consisting of low viscosity poly-aliphatic olefin, mineral oil, silicone oil, synthetic oil, gallium and liquid metal.
An electronic assembly including a thermal joint comprising:
- a substrate;
- at least one electronic component attached to said substrate;
- cooling means;
- a thermal joint for transferring heat from said at least one electronic component to said cooling means while providing compliance for manufacturing and for thermally induced variations of said at least one electronic component, said thermal joint comprising:
- a first layer of planarized high thermal conductivity material adapted to be in thermal contact with said at least one electronic component;
- and
- a second layer of lubricant having a thickness less than that of said first layer, said first layer and said second layer being adapted to be disposed between said at least one electronic component and said cooling means, said second layer being adapted to be in thermal contact with said cooling means;
- wherein said thermal joint further comprises an anti-adhesion coating.
An electronic assembly including a thermal joint comprising:
- a substrate;
- at least one electronic component attached to said substrate;
- cooling means;
- a thermal joint for transferring heat from said at least one electronic component to said cooling means while providing compliance for manufacturing and for thermally induced variations of said at least one electronic component, said thermal joint comprising:
- a first layer of planarized high thermal conductivity material adapted to be in thermal contact with said at least one electronic component;
- a second layer of lubricant having a thickness less than that of said first layer, said first layer and said second layer being adapted to be disposed between said at least one electronic component and said cooling means, said second layer being adapted to be in thermal contact with said cooling means;
- and
- a foil layer disposed between said first and second layers and adapted to be coupled to said substrate.
An electronic assembly including a thermal joint comprising:
- a substrate;
- at least one electronic component attached to said substrate;
- cooling means;
- a thermal joint for transferring heat from said at least one electronic component to said cooling means while providing compliance for manufacturing and for thermally induced variations of said at least one electronic component, said thermal joint comprising:
- a first layer of planarized high thermal conductivity material adapted to be in thermal contact with said at least one electronic component;
- and a second layer of lubricant having a thickness less than that of said first layer, said first layer and said second layer being adapted to be disposed between said at least one electronic component and said cooling means, said second layer being adapted to be in thermal contact with said cooling means;
- wherein said thermal joint further comprises retainer means adapted to be disposed on said at least one electronic component.
An electronic assembly including a thermal joint comprising:
- a substrate;
- at least one electronic component attached to said substrate;
- cooling means;
- a thermal joint for transferring heat from said at least one electronic component to said cooling means while providing compliance for manufacturing and for thermally induced variations of said at least one electronic component, said thermal comprising:
- a first layer of planarized high thermal conductivity material adapted to be in thermal contact with said at least one electronic component;
- and
- a second layer of lubricant having a thickness less than that of said first layer, said first layer and said second layer being adapted to be disposed between said at least one electronic component and said cooling means, said second layer being adapted to be in thermal contact with said cooling means;
- wherein at least one of said first layer or said cooling means includes a textured surface.
An electronic assembly including a thermal joint comprising:
- a substrate;
- at least one electronic component attached to said substrate;
- cooing means;
- a thermal joint for transferring heat from said at least one electronic component to said cooling means while providing compliance for manufacturing and for thermally induced variations of said at least one electronic component, and thermal joint comprising:
- a first layer of planarized high thermal conductivity material adapted to be in thermal contact with said at least one electronic component;
- and
- a second layer of lubricant having a thickness less than that of said first layer, said first layer and said second layer being adapted to be disposed between said at least one electronic component and said cooling means, said second layer being adapted to be in thermal contact with said cooling means;
- wherein said first layer is an alloy comprising a first metal that is self-passivating and a second metal that expands upon freezing.
An electronic assembly including a thermal joint comprising:
- a substrate;
- at least one electronic component attached to said substrate;
- cooling means;
- a thermal joint for transferring heat from said at least one electronic component to said cooling means while providing compliance for manufacturing and for thermally induced variations of said at least one electronic component, said thermal joint comprising:
- a first layer of planarized high thermal conductivity material adapted to be in thermal contact with said at least one electronic component;
- and
- a second layer of lubricant having a thickness less than that of said first layer, said first layer and said second layer being adapted to be disposed between said at least one electronic component and said cooing means, said second layer being adapted to be in thermal contact with said cooling means;
- and
- a button layer disposed between said first layer and said second layer, said button layer having a bulk thermal conductivity and thickness greater than that of said first layer.
An electronic assembly including a thermal joint comprising:
- a substrate;
- at least one electronic component attached to said substrate;
- cooling means;
- a thermal joint for transferring heat from said at least one electronic component to said cooling means while providing compliance for manufacturing and for thermally induced variations of said at least one electronic component, said thermal joint comprising:
- a first layer of planarized high thermal conductivity material adapted to be in thermal contact with said at least one electronic component;
- and
- a second layer of lubricant having a thickness less than that of said first layer, said first layer and said second layer being adapted to be disposed between said at least one electronic component and said cooling means, said second layer being adapted to be in thermal contact with said cooling means;
- wherein said cooing means comprises a bendable compliant bottom surface.
Dependencies are inferred from the claim text.