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US 5,291,066 AGranted
Moisture-proof electrical circuit high density interconnect module and method for making same
AssigneeGeneral Electric Company
InventorsConstantine A. Neugebauer, Herbert S. Cole, Eugene L. Bartels, Raymond A. Fillion
Life of this patent
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Abstract
A moisture-proof integrated circuit module includes at least one integrated circuit component in a high density interconnect (HDI) structure fabricated by applying to a substrate successive multiple ply sequences having a plurality of via holes therein. The sequences overlie the component(s) and the module substrate, and each sequence includes a dielectric film and a plurality of lands comprised of metal that extends into the vias of the sequence to provide electrical interconnections. The module includes at least one moisture barrier film to prevent penetration of moisture through the module to the circuit component(s).
Claims15
A moisture-proof, electrical circuit module comprising:
- a substrate;
- at least one electrical circuit component situated free standing on said substrate;
- and
- an electrical interconnection structure comprising a plurality of multiple ply sequences successively stacked over said at least one component and said substrate, each of said sequences including at least a dielectric polymer film and a metal layer overlying said polymer film;
- at least one of said plurality of sequences further including an inorganic oxide moisture barrier film underlying said polymer film;
- said inorganic oxide moisture barrier film being other than immediately adjacent said at least one component;
- each of said films including a plurality of via holes extending therethrough, each of said holes exposing a metal surface, at least one of said metal surfaces being electrically connected to said circuit component, the interior surface of each of said holes being lined by the metal layer of the corresponding sequence to establish a conductive link between the metal layer of the corresponding sequence and the underlying exposed metal surface;
- whereby electrical connections to said at least one circuit component are established through said via holes and moisture is prevented from penetrating to said circuit component.
5 more elements
In an integrated circuit module:
- a substrate;
- a plurality of mutually spaced, integrated circuit chips situated on said substrate each including a plurality of interconnection pads;
- said substrate including at least one interconnection pad disposed for connection external to said module;
- a first film overlying said chips and said substrate comprising an inorganic oxide material;
- a second film overlying said first film comprising a dielectric polymer material;
- said first and second films containing a plurality of via holes extending therethrough, each of said via holes exposing an interconnection pad beneath said first film;
- and
- a metal layer comprising lands of metal overlying portions of said second film, said lands additionally extending through said via holes to make electrical contact with at least some of the interconnection pads positioned therebelow;
- whereby moisture is prevented from penetrating to said chips.
6 more elements
A moisture-proof, electrical circuit module comprising:
- a substrate,
- at least one electrical circuit component situated free standing on said substrate;
- an electrical interconnection structure overlying said circuit component;
- and
- an outer coating overlying the top and sides of said electrical interconnection structure, said outer coating including an inorganic oxide moisture barrier film;
- whereby moisture is prevented from penetrating to said at least one circuit component.
3 more elements
A moisture-proof, integrated circuit module comprising:
- a substrate having a plurality of metal interconnection pads disposed thereon;
- a plurality of integrated circuit chips on said substrate, each of said chips having a second plurality of metal interconnection pads disposed thereon;
- and
- an electrical interconnection structure including a plurality of multiple ply sequences successively stacked over said chips and said substrate, each of said sequences including at least a dielectric polymer film and a metal layer comprising metal lands overlying predetermined areas of said polymer film, at least some of said plurality of sequences further including an inorganic oxide moisture barrier film underlying said polymer film thereof;
- said substrate having a substantially planar surface including at least one cavity having one or more of said chips situated therein, each of said chips having its top surface at a level substantially even with said planar substrate surface and being free standing within said cavity such that the space surrounding each of said chips is bridged by the polymer film of the sequence disposed adjacent said substrate;
- each of said plurality of sequences having a plurality of via holes extending through the entire film portion thereof, the via holes of said sequence disposed adjacent said substrate exposing selected pads on said substrate and on said chips, and the via holes of all sequences remote from said substrate exposing the metal lands of the sequence immediately underneath;
- in each of said sequences the interior surfaces of the via holes being lined by the metal layer thereof to establish a conductive link between the last-recited metal layer and the exposed metal, so that said metal lands conductively link respective ones of said interconnection pads to establish communication between connected pads and circuitry external to said module;
- and
- an outer coating overlying the electrical interconnection structure of said module and including an additional inorganic oxide moisture barrier film directly overlying the top and sides of said electrical interconnection structure, and a dielectric polymer film overlying said additional moisture barrier film on the top of said electrical interconnection structure;
- whereby moisture is prevented from penetrating to said chips.
7 more elements
Dependencies are inferred from the claim text.