Lead frame and semiconductor device using same

A multi-layer lead frame for at least one semiconductor chip comprising:

• a lead frame body made of a metal strip and having an opening and a plurality of inner leads, said inner leads having respective tips which define at least a part of said opening;
• a metal plane which is independent from said lead frame body and has top and bottom planar surfaces, said metal plane having wire bonding areas and inner holes formed in the metal plane and located beside said wire bonding areas within said opening;
• and
• an insulative adhesive layer adhering said top planar surface to said inner leads.

A semiconductor device comprising:

• (a) a multi-layer lead frame for a semiconductor device comprising:
• a lead frame body made of a metal strip and having an opening and a plurality of inner leads, said inner leads having respective tips which define at least a part of said opening;
• a metal plane which is independent from said lead frame body and has top and bottom planar surfaces, said metal plane having a stage portion, wire bonding areas at a peripheral portion of said stage portion within said opening and through holes formed in said metal plane and located beside said wire bonding areas;
• and
• an insulative adhesive layer adhering said top planar surface to said inner leads;
• (b) a semiconductor chip mounted on said stage portion;
• (c) bonding-wires electrically connecting said semiconductor chip to said wire bonding areas of said metal plane;
• and
• (d) a resin hermetically and integrally molding at least a part of said multi-layer lead frame, said semiconductor chip, and said bonding-wires in such a manner that said through holes are also filled with said resin.