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US 5,291,059 AGranted
Resin-molded semiconductor device and lead frame employed for fabricating the same
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsMasahiro Ishitsuka, Kazuyuki Hayashi
Life of this patent
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Abstract
A semiconductor device has a lead, an inner lead of which is upwardly bent while an outer lead is downwardly bent. A junction part of the outer lead is guided from a resin block on a level which is lower than that of an upper major surface of the semiconductor chip. In fabrication of this semiconductor device, a guide frame of a lead frame, a suspending lead and a die pad held by the same are flush with each other.
Claims5
A semiconductor device comprising:
- (a) a die pad;
- (b) a semiconductor chip having upper and lower major surfaces, said lower major surface being fixed onto said die pad;
- (c) a connection lead having:
- (c-1) an inner lead being arranged in a side space of said semiconductor chip and having a first part being located on a first level being lower than said upper major surface of said semiconductor chip and a second part extending from an end of said first part to be upwardly bent and being located on a second level being higher than said first level, said second chip being electrically connected to said semiconductor chip, and
- (c-2) an outer lead extending from the other end of said first part of said inner lead to be downwardly bent;
- and
- (d) a resin block sealing said die pad, said semiconductor chip and said inner lead with resin;
- wherein:
- said second level is substantially equal to the level of said upper major surface of said semiconductor chip;
- said outer lead has:
- (c-2-1) a part which is bent on a third level being lower than said first level as well as the level of the lower surface of said resin block;
- and
- said first level is substantially equal to the level of said die pad.
10 more elements
A lead frame comprising:
- (a) a guide frame having a window;
- (b) a suspending lead being coupled to said guide frame to extend in said window;
- (c) a die pad being supported in said window by said suspending lead;
- (d) an outer lead being coupled to said guide frame to extend in said window through a path being different from that of said suspending lead;
- and
- (e) an inner lead comprising elements of:
- (e-1) a first part having an end being coupled to said outer lead to be located on a first level;
- and
- (e-2) a second part extending from the other end of said first part and being upwardly bent to be located on a second level being higher than said first level;
- said outer lead comprises:
- (d-1) a part extending from said second part of said inner lead to be downwardly bent and being further bent on a third level which is lower than said first level;
- wherein:
- said first level is substantially equal to the level of said die pad.
10 more elements
Dependencies are inferred from the claim text.