Printed circuit board provided with a higher density of terminals for hybrid integrated circuit and method of fabricating the same
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsTsuneo Hamaguchi, Masanobu Kohara
Life of this patent
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Abstract
This invention relates to printed circuit boards and a method of fabricating same wherein the input/output terminals are integral with the wiring layer of the printed circuit board. This arrangement allows for a higher density of input/output connections than is possible with conventional printed circuit boards.
Claims13
A printed circuit board comprising:
- a substrate;
- a wiring layer on top of said substrate wherein said wiring layer includes conductors and insulators and is arranged on said substrate, at least part of said wiring layer having a periphery which is larger than a periphery of said substrate such that peripheral sections of said wiring layer protrude beyond said substrate, and wherein conductors in the protruding peripheral sections of said wiring layer are exposed and comprise input/output terminals of said printed circuit board with the input/output terminals located at the protruding peripheral sections.
A printed circuit board comprising a plurality of printed circuit boards stacked one on top of another each comprising a substrate having a substantially U-shaped sectional configuration and a wiring layer wherein said wiring layer has conductors and insulators and is arranged on said substrate such that the peripheral sections of said wiring layer protrude beyond said substrate;
- wherein the conductors located in said protruding peripheral sections of said wiring layer are exposed and comprise input/output terminals located in the protruding peripheral sections;
- the input/output terminals formed on one printed circuit board being connected to those conductors which are exposed on the upper surface of the wiring layer of another printed circuit board.
A method of fabricating a printed circuit board which comprises the steps of:
- (1) forming on a substrate a wiring layer having conductors and insulators;
- (2) removing peripheral sections of said substrate on which said wiring layer has been formed, such that the conductors of said wiring layer are exposed adjacent to locations where the peripheral sections of said substrate have been removed such that said wiring layer includes sections which protrude beyond peripheral sections of said substrate, and wherein the protruding sections of said wiring layer include the exposed conductors which form input/output terminals located in the protruding sections of the wiring layer.
Dependencies are inferred from the claim text.