Curable fluorosilicone resin composition

Abstract

A curable fluorosilicone resin composition is disclosed, which composition comprises (A) 100 parts by weight of a fluorosilicone resin obtained by cohydrolyzing a mixture of (a) 50 to 95 mole percent of a perfluoroalkyl-containing organosilane having the formula R--CH.sub.2 CH.sub.2 SiX.sub.3, (b) 5 to 50 mole percent of an epoxy-containing organosilane having the formula Z.sub.w SiX.sub.4-w and, optionally, (c) up to 50 mole percent of an organosilane having the formula R.sup.1.sub.n SiX.sub.4-n, wherein R is a perfluoroalkyl group containing 4 to 15 carbon atoms, X is a hydrolyzable group, Z is an epoxy-containing monovalent organic group, R.sup.1 is hydrogen or a monovalent hydrocabon group containing 1 to 15 carbon atoms, w is 1, 2 or 3 and n is 0, 1, 2 or 3; and (B) 1 to 50 parts by weight of a crosslinking agent selected from the group consisting of (i) an amino group-containing organosilicon compound that contains at least 2 nitrogen-bonded active hydrogens in each molecule and (ii) a fluorine compound that contains at least 2 carboxyl groups and at least 2 fluorine atoms in each molecule. When cured, the composition provides a film that is both highly water repellent and highly oil repellent.

Dependencies are inferred from the claim text.