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AssigneeNitto Denko Corporation
InventorsToshitsugu Hosokawa, Takeshi Yamanaka, Hiraku Yamamoto, Koichi Hashimoto, Akihisa Murata, Katsuhito Kamiya
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An expoxy resin composition, an epoxy resin cured product obtained therefrom, and a bonding method using the composition are disclosed. The epoxy resin composition comprises an epoxy resin composition comprising (A) 100 parts by weight of an epoxy resin, (B) from 1 to 80 parts by weight of a heat activatable hardener, and (C) from 10 to 100 parts by weight of an aromatic thermoplastic resin powder having a glass transition temperature of 120.degree. C. or more and an average particle diameter of 200 .mu.m or less, said components (A), (B) and (C) being present in a phase separation state.
An epoxy resin composition comprising (A) 100 parts by weight of an epoxy resin, (B) from 1 to 80 parts by weight of a heat activatable hardener, and (C) from 10 to 100 parts by weight of an aromatic thermoplastic resin powder having a glass transition temperature of 120.degree. C. or more and an average particle diameter of 200 .mu.m or less which dissolves in said epoxy resin (A) upon heating at a temperature effective to compatibilize epoxy resin (A) and aromatic thermoplastic resin (C) at below the curing temperature of said epoxy resin (A), and said epoxy resin (A) and said aromatic thermoplastic resin (C) being present in a phase separation state after curing said epoxy resin composition, wherein said epoxy resin (A) reverses from a continuous phase before heat-curing to a discontinous phase after heat-curing, and said aromatic thermoplastic resin (C) reverses from a discontinuous phase before heat-curing to a continous phase after heat-curing.
A method of curing an epoxy resin composition comprising heating a mixture of (A) 100 parts by weight of an epoxy resin, (B) from 1 to 80 parts by weight of a heat activatable hardener, and (C) from 10 to 100 parts by weight of an aromatic thermoplastic resin powder having a glass transition temperature of 120.degree. C. or more and an average particle diameter of 200 .mu.m or less, at a temperature effective to dissolve said aromatic thermoplastic resin (C) in said epoxy resin (A) at below the curing temperature of said epoxy resin (A), then raising the temperature sufficiently to effect a heat cure of said epoxy resin composition providing a phase separation of said epoxy resin (A) and said aromatic thermoplastic resin (C), wherein said epoxy resin (A) reverses from a continuous phase before heat-curing to a discontinous phase after heat-curing, and said aromatic thermoplastic resin (C) reverses from a discontinuous phase before heat-curing to a continous phase after heat-curing.
Dependencies are inferred from the claim text.