Thermosetting resin compositions
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsToshio Shiobara, Hisashi Shimizu, Manabu Narumi
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Abstract
A thermosetting resin composition contains (A) an imide compound having a maleimide group, (B) an epoxy resin, (C) a phenolic resin, and optionally, (D) an aromatic polymer/organopolysiloxane copolymer. Component (B) and/or (C) includes a compound containing a naphthalene ring having an allyl group and preferably, a compound containing a naphthalene ring and a double bond conjugated with an aromatic ring. The composition is easily workable and cures to products having improved heat resistance, low thermal expansion, and low water absorption.
Claims10
A thermosetting resin composition comprising:
- (A) an imide compound having a maleimide group of the general formula (I):
- ##STR44## (B) a resin having at least two epoxy groups in a molecule, and (C) a resin having a phenolic hydroxyl group in a molecule,
- wherein at least one of the resins of components (B) and (C) further comprises a naphthalene ring substituted with an allyl group in the molecule of the resin.
Dependencies are inferred from the claim text.