Flat-topped wave-board panel

A wave-board panel which comprises a panel formed of a mat of thermosetting resin and wax admixed with wafers having a length ranging from about 1" to 12", a thickness ranging from 0.02" to 0.06", width ranging from 0.2" to 2", and a resin content ranging from about 1% to about 6% wherein said mat has been converted from a planar to a wave configuration and subjected to binder curing and compression, said board having a flat-peaked and a flat-troughed profile, a panel depth of 2" to 6", a panel thickness of 0.25" to 0.75", said panel further having an essentially uniform density throughout, and a significantly improved Unit E1 bending stiffness over a sinusoidal or flat wafer board panel.